Waterbased acrylic PSA heat resistance is the ability of water-based acrylic pressure sensitive adhesives to maintain adhesion, cohesion, and overall performance when exposed to elevated temperatures (typically 60°C to 150°C), critical for applications such as automotive under-the-hood components, electronics assembly, and heat-sealed packaging. High temperatures can cause the adhesive to soften, leading to reduced shear resistance (slip or failure under load) or chemical degradation, compromising bonding integrity. To enhance heat resistance, formulators adjust monomer composition by incorporating heat-stable monomers such as methyl methacrylate (MMA) and isobornyl acrylate, which have rigid molecular structures that resist softening at high temperatures. Increasing the proportion of these monomers raises the adhesive’s glass transition temperature (Tg), improving thermal stability. Crosslinking technology is a key strategy—using crosslinkers like aziridines, isocyanates, or epoxy-functional monomers creates a three-dimensional polymer network that resists flow under heat, enhancing cohesion. High-molecular-weight polymers, produced through controlled polymerization, improve shear resistance at elevated temperatures by increasing chain entanglement. Heat stabilizers (e.g., hindered phenols, phosphites) are added to scavenge free radicals generated by thermal oxidation, slowing polymer degradation. Tackifiers with high thermal stability, such as hydrogenated rosin esters or synthetic polyterpenes, replace traditional tackifiers that may soften or decompose at high temperatures. Testing involves measuring shear holding power at target temperatures (e.g., 120°C for automotive applications) using ASTM D3654, evaluating peel strength after heat aging, and checking for discoloration or flow. For extreme applications, formulations may include ceramic or metallic fillers to further enhance heat resistance. These advancements ensure that waterbased acrylic PSAs can withstand the thermal conditions of engine compartments, electronics enclosures, and industrial ovens, maintaining reliable bonding without failure, expanding their use in high-temperature industrial settings.